This product is the most widely used type of Lid Assembly. Not only is it cost effective, but it provides superior board flatness while the UUT is under test. Vacuum can overcome up to 10lbs per square inch of force, and in doing so, keeping all platens flat and parallel to each other. This is critical to reduce board flex and component/solder joint damage. This technology has been used in fixtures with up to 10K probes installed successfully. Arcadia offers many standard size lids for Teradyne, Agilent, and functional applications, as well as custom sizes to meet every need.