Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.